■ Specifications
Cu5Si is a kind of inter-metallic compound with properties between ionic compounds and alloys. It has excellent electrical conductivity, thermal conductivity, ductility, corrosion resistance and wear resistance.Copper silicide films can be used to passivate the copper based chips, inhibit diffusion and electron transport. And as diffusion barrier, copper silicide can also be directly used as organic silicon compounds in industry.
Performance characteristics:
1, High purity: XRD detected no impurity phase;
2. Concentrated distribution: standard normal distribution of particle size, no bimodal or multi-modal.
■ Technical Data
- 3D print&thermal spray series
-
- thermal spray Niobium carbide-N
- thermal spray Hafnium carbide-H
- thermal spray vanadium carbide-
- thermal spray Zirconium Diborid
- 3D printing spherical tantalum
- thermal spray Hafnium Nitride -
- thermal spraying Zirconium Nitr
- thermal spray Titanium diboride
- 3D printing spherical titanium
- thermal spray Niobium powder-Nb
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product is same as per standard ISO354(DIN1494)
